文章信息/Info

Title:

Progress and Prospect of Ultra Conductive Copper Matrix Materials

作者:

呂吉敏1; 章瀟慧2; 熊定邦1; 張荻1

1.上海交通大學(xué) 金屬基復(fù)合材料國家重點實驗室，上海 200240?

2.中車工業(yè)研究院有限公司，北京 100067

Author(s):

LV Jimin1;  ZHANG Xiaohui2;  XIONG Dingbang1;  ZHANG Di1

1.State Key Laboratory of Metal Matrix Composites, Shanghai Jiao Tong University, Shanghai 200240, China

2.CRRC Industrial Institute Corporation Limited, Beijing 100067, China

關(guān)鍵詞:

超高導(dǎo)電銅; 銅基復(fù)合材料; 碳納米管; 石墨烯; 制備方法

Keywords:

ultra conductive copper;  copper matrix composite;  carbon nanotube;  graphene;  fabrication method

DOI:

10.7502/j.issn.1674-3962.2018.06.07

文獻標志碼:

A

摘要:

超高導(dǎo)電銅是指導(dǎo)電性能優(yōu)于國際退火銅標準的一類銅材料，其在機械、電子和電力等領(lǐng)域具有廣闊的應(yīng)用前景。綜述了超高導(dǎo)電銅的研究現(xiàn)狀，介紹了純銅、銅合金和銅基復(fù)合材料3類超高導(dǎo)電銅體系，其中，最有望實現(xiàn)大規(guī)格超高導(dǎo)電銅的方法是在銅基體中加入碳納米管或石墨烯等碳納米材料。隨后，指出了現(xiàn)階段超高導(dǎo)電銅基復(fù)合材料制備存在的3個關(guān)鍵問題：良好的電學(xué)接觸界面、優(yōu)化復(fù)合材料的構(gòu)型和實現(xiàn)碳納米材料良好的結(jié)構(gòu)/本征性能與均勻分散的協(xié)同。基于這3個關(guān)鍵問題，介紹了鑄造、電解共沉積、化學(xué)氣相沉積法、粉末冶金法等一系列有望制備超高導(dǎo)電銅基復(fù)合材料的方法，并總結(jié)了其優(yōu)缺點。最后，對超高導(dǎo)電銅未來發(fā)展趨勢進行了展望。

Abstract:

Ultra conductive copper, which has higher electrical conductivity than international annealed copper standard (IACS), has wide application prospect in the fields of machinery, electronics and electricity. This paper summarized the research progress of ultra�瞔onductive copper including pure copper, copper alloys, and copper matrix composites. Among these, adding carbon nano�瞞aterials such as carbon nanotube and graphene to fabricate copper matrix composite is most promising for promoting the electrical conductivity of copper. Whereafter, this paper pointed out three key points relating to the fabrication of ultra�瞔onductive copper matrix composite, including good interface bonding, microstructure architecture, blance between structural integrity and uniform dispersion ability. Based on the key points, this paper introduced methods of fabricating ultra�瞔onductive copper matrix composite, and analyzed their advantages and weakness, such as casting, electrolytic co�瞕eposition, chemical vapor deposition, powder metallurgy, and so on. Finally, this paper pointed out the future trends of ultra�瞔onductive copper research.