文章信息/Info

Title:

Applications of FIB/SEM DualBeam system for Micro-Nanofabrication and characterization

作者:

彭開武

(國(guó)家納米科學(xué)中心 納米檢測(cè)實(shí)驗(yàn)室,北京100190)

Author(s):

PENG Kaiwu

(Testing Laboratory for Nanostructures, National Center for Nanoscience and Technology, Beijing 100190, China)

關(guān)鍵詞:

聚焦離子束、雙束系統(tǒng)、納米材料表征、納米結(jié)構(gòu)加工、電子束曝光、透射電鏡樣品制備

DOI:

10.7502/j.issn.1674-3962.2013.12.03

摘要:

簡(jiǎn)要回顧了聚焦離子束/掃描電子顯微鏡雙束系統(tǒng)在國(guó)家納米科學(xué)中心的應(yīng)用。圍繞納米材料表征與納米結(jié)構(gòu)加工兩方面，以一些具體實(shí)例分類進(jìn)行了介紹。材料表征方面包括：透射電鏡樣品制備、掃描電子顯微鏡與掃描離子顯微鏡、納米材料的二維與三維表征；微納米結(jié)構(gòu)加工方面包含：離子束直接刻蝕加工（如光子晶體陣列器件原型加工）、材料沉積加工（如用于電學(xué)性能測(cè)試的四電極制作）、指定點(diǎn)加工（如原子力顯微鏡針尖修飾）、三維加工、電子束曝光及其與聚焦離子束聯(lián)合加工等。應(yīng)用領(lǐng)域涉及材料科學(xué)、電子學(xué)、生命科學(xué)、工業(yè)應(yīng)用等。針對(duì)限制其應(yīng)用的一些不利因素，如加工效率低、面積小、精度不足、加工損傷等問題，一些新技術(shù)，如新型離子源Plasma、He+/Ne+離子等與現(xiàn)有Ga+聚焦離子束系統(tǒng)配合將是未來發(fā)展方向。

Abstract:

The applications of Focused Ion Beam (FIB) /Scanning Electron Microscopy (SEM) DualBeam system at National Center for Nanoscience and Technology for micro-nanofabrication and characterization of nanomaterial are briefly reviewed by means of a lot of typical practical examples. Regarding characterization of nanomaterial, the capabilities, such as TEM sample preparation, Scanning Ion Microscopy (SIM), 2D and 3D characterization of nanomaterial, are illustrated. And as for micro-nanofabrication, the applications include: (1) direct milling for nanostructures, for instance, photonic array prototyping; (2) precise material deposition, for example, platinum metal deposition for four-electrode measurement; (3) site specific fabrication, such as AFM tip modification; (4)3D nanofabrication. (5) electron beam lithography (EBL) and its combination with FIB. The application fields of DualBeam system involve material science, electronics, life science and natural resources. To extend the application field, a number of new technologies, including various new types ion source, such as plasma, He+ and Ne+ are expected to be used in the near future to overcome some present disadvantages, for instance, low productivity, small fabrication area, bad fabrication precision, FIB induced damage and so on