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Title:: Recent Advances on Solvent-free Insulation Organosilicon Impregnating Resin

Author(s):: LI Meijiang1; HOU Xinrui1; WU Huajun2; (1.Key Laboratory of Organosilicon Chemistry and Material Technology of Ministry of Education, Hangzhou Normal University, Hangzhou, 311121, Zhejiang, China)
(2.Jiaxing hindailo mechanical and electrical Co. Ltd., Jiaxing, 314005, Zhejiang, China)
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Keywords:: impregnating resin; insulation; organosilicon resin; solvent-free; heat-resistant

Abstract:: Insulation impregnating resin is one of important insulation materials of electric and electronic equipment winding, and it can improve insulation system the dielectric, thermal conductivity, mechanical and protective properties. Along with the high-capacity, lightweight and intelligent development of motor or electrical equipment, also with high voltage and long distance transmission development of power transformer, people have put forward the higher requirement for quality and reliability, especially the heat-resistant performance of insulation resin. Comparing with other insulation impregnating resin, solvent-free insulation organosilicon impregnating resin with organic-inorganic hybrid materials characteristics and excellent comprehensive performance, is the most promising heat-resistant insulation impregnating resin. In this review, the molecular structure, peculiarity and classify of insulation organosilicon impregnating resin are firstly introduced, in which the special attention are focused on the composition, properties and application field, especially on the preparation method of solvent-free insulation organosilicon impregnating resin. This review ends with a summary and some perspectives on the challenges and new directions in this exciting and still emerging area of research.